ENERGY MANAGEMENT
|
Thermal Design Power (TDP) |
125 W |
Configurable TDP-down |
95 W |
Configurable TDP-down frequency |
3 GHz |
FEATURES
|
Supported instruction sets |
SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
PCI Express slots version |
4.0 |
Execute Disable Bit |
Yes |
Idle States |
Yes |
Thermal Monitoring Technologies |
Yes |
Scalability |
1S |
CPU configuration (max) |
1 |
Embedded options available |
No |
PCI Express configurations |
1x16+1x4, 2x8+1x4, 1x8+3x4 |
Maximum number of PCI Express lanes |
20 |
Market segment |
Desktop |
Harmonized System (HS) code |
85423119 |
Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0,AVX-512 |
Export Control Classification Number (ECCN) |
5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) |
G167599 |
Use conditions |
PC/Client/Tablet |
PCI Express slots version |
4.0 |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Scalability |
1S |
CPU configuration (max) |
1 |
Embedded options available |
N |
PCI Express configurations |
1x16+1x4,2x8+1x4,1x8+3x4 |
Thermal Design Power (TDP) |
125 W |
Maximum number of PCI Express lanes |
20 |
Market segment |
Desktop |
Processor package size |
37.5 x 37.5 mm |
Harmonized System (HS) code |
8542310001 |
Processor ARK ID |
212321 |
Export Control Classification Number (ECCN) |
5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) |
G167599 |
Use conditions |
PC/Client/Tablet |
GRAPHICS
|
On-board graphics card model |
Not available |
Discrete graphics card model |
Not available |
On-board graphics card |
No |
Discrete graphics card |
No |
On-board graphics adapter model |
Not available |
Discrete graphics adapter model |
Not available |
On-board graphics adapter |
N |
Discrete graphics adapter |
N |
LOGISTICS DATA
|
Country of origin |
Malaysia |
Harmonized System (HS) code |
85423119 |
MEMORY
|
ECC |
No |
ECC |
N |
Memory bandwidth (max) |
50 GB/s |
Memory channels |
Dual-channel |
Maximum internal memory supported by processor |
128 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
3200 MHz |
Memory bandwidth (max) |
50 GB/s |
Supported memory types |
DDR4-SDRAM |
Memory channels support |
Dual-channel |
Maximum internal memory supported by processor |
128 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
3200 MHz |
Memory bandwidth supported by processor (max) |
50 GB/s |
OPERATIONAL CONDITIONS
|
Tjunction |
100 °C |
Tjunction |
100 °C |
OTHER FEATURES
|
Maximum internal memory |
128 GB |
Maximum internal memory |
128 GB |
CPU configuration (max) |
1 |
PACKAGING DATA
|
Package weight |
74 g |
Package type |
Retail box |
Package type |
Retail box |
PROCESSOR
|
Processor model |
i9-11900KF |
Processor manufacturer |
Intel |
Processor model |
i9-11900KF |
Processor lithography |
14 nm |
Processor family |
Intel® Core™ i9 |
Box |
Yes |
Processor socket |
LGA 1200 (Socket H5) |
Processor manufacturer |
Intel |
Processor process |
14 nm |
Processor cores |
8 |
System bus rate |
8 GT/s |
Processor threads |
16 |
Processor operating modes |
64-bit |
Processor boost frequency |
5.3 GHz |
Component for |
PC |
Processor cache |
16 MB |
Processor family |
11th gen Intel® Core™ i9 |
Thermal Design Power (TDP) |
125 W |
Box |
Y |
Processor socket |
LGA 1200 (Socket H5) |
Configurable TDP-down |
95 W |
Processor cache type |
Smart Cache |
Configurable TDP-down frequency |
3 GHz |
Memory bandwidth supported by processor (max) |
50 GB/s |
Processor ARK ID |
212321 |
Processor base frequency |
3.5 GHz |
Processor generation |
11th gen Intel® Core™ i9 |
Processor number of cores |
8 |
System bus |
8 GT/s |
Processor number of threads |
16 |
Processor operating modes |
64-bit |
Turbo frequency (max) |
5.3 GHz |
Component for |
PC |
Processor cache |
16 MB |
Thermal Design Power (TDP) |
125 W |
Configurable TDP-down |
95 W |
Processor cache type |
Smart Cache |
Configurable TDP-down frequency |
3 GHz |
Memory bandwidth supported by processor (max) |
50 GB/s |
Processor ARK ID |
212321 |
Processor base frequency |
3.5 GHz |
PROCESSOR SPECIAL FEATURES
|
Intel® Identity Protection Technology (Intel® IPT) |
Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Yes |
Intel® Turbo Boost Technology |
2.0 |
Intel® AES New Instructions (Intel® AES-NI) |
Yes |
Enhanced Intel SpeedStep Technology |
Yes |
Intel Trusted Execution Technology |
No |
Intel VT-x with Extended Page Tables (EPT) |
Yes |
Intel® Secure Key |
Yes |
Intel 64 |
Yes |
Intel Stable Image Platform Program (SIPP) |
No |
Intel® OS Guard |
Yes |
Intel Virtualization Technology for Directed I/O (VT-d) |
Yes |
Intel Software Guard Extensions (Intel SGX) |
No |
Intel Virtualization Technology (VT-x) |
Yes |
Intel Turbo Boost Max Technology 3.0 |
Yes |
Intel® Optane? Memory Ready |
Yes |
Intel® Boot Guard |
Yes |
Intel® Thermal Velocity Boost |
Yes |
Intel® vPro? Platform Eligibility |
No |
Intel® Deep Learning Boost (Intel® DL Boost) |
Yes |
Intel® Thermal Velocity Boost Frequency |
5.3 GHz |
Intel® Thermal Velocity Boost Temperature |
70 °C |
Intel® Turbo Boost Max Technology 3.0 frequency |
5.2 GHz |
Intel® Turbo Boost Technology 2.0 frequency |
5.1 GHz |
Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 |
Yes |
Intel Identity Protection Technology |
Y |
Intel Hyper-Threading Technology |
Y |
Intel Turbo Boost Technology |
2.0 |
Intel AES New Instructions |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel Trusted Execution Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel Secure Key |
Y |
Intel 64 |
Y |
Intel Stable Image Platform Program (SIPP) |
N |
OS Guard |
Y |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Intel Software Guard Extensions (Intel SGX) |
N |
Intel Virtualization Technology (VT-x) |
Y |
Intel Turbo Boost Max Technology 3.0 |
Y |
Intel® Optane? Memory Ready |
Y |
Intel® Boot Guard |
Y |
Intel® Thermal Velocity Boost |
Y |
Intel® vPro? Platform Eligibility |
N |
Intel® Deep Learning Boost (Intel® DL Boost) |
Y |
Intel® Thermal Velocity Boost Frequency |
5.3 GHz |
Intel® Thermal Velocity Boost Temperature |
70 °C |
Intel® Turbo Boost Max Technology 3.0 frequency |
5.2 GHz |
Intel® Turbo Boost Technology 2.0 frequency |
5.1 GHz |
Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 |
Y |
TECHNICAL DETAILS
|
Supported memory types |
DDR4-SDRAM |
Status |
Launched |
Launch date |
Q1''21 |
Target market |
Gaming, Content Creation |
Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0,AVX-512 |
Supported memory types |
DDR4-SDRAM |
PCI Express slots version |
4.0 |
Intel Identity Protection Technology |
Y |
Intel Hyper-Threading Technology |
Y |
Intel Turbo Boost Technology |
2.0 |
Intel AES New Instructions |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Intel Trusted Execution Technology |
N |
Scalability |
1S |
CPU configuration (max) |
1 |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Embedded options available |
N |
PCI Express configurations |
1x16+1x4,2x8+1x4,1x8+3x4 |
Thermal Design Power (TDP) |
125 W |
Intel Secure Key |
Y |
Intel 64 |
Y |
Intel Stable Image Platform Program (SIPP) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Cache type |
Smart Cache |
Status |
Launched |
Launch date |
Q1''21 |
Intel Virtualization Technology (VT-x) |
Y |
Market segment |
Desktop |
Target market |
Gaming, Content Creation |
WEIGHT & DIMENSIONS
|
Weight |
60 g |
Height |
101 mm |
Width |
44 mm |
Depth |
116 mm |
Processor package size |
37.5 x 37.5 mm |
Processor package size |
37.5 x 37.5 mm |