TRX50 AERO D (rev. 1.0)
Key Features
Supports AMD Ryzen Threadripper PRO 7000 series/ Ryzen Threadripper 7000 series Processors?
Breakthrough Performance:16+8+4 Phases Digital VRM Solution
Quad Channel DDR5:4*SMD R-DIMMs with AMD EXPO & Intel XMP Memory Module Support
Reinforced Overall Thermal:VRM Thermal Armor Advanced & M.2 Thermal Guard
Ultimate Scalibility: 3*PCIe x16 slots for Multi-GPU and 4*PCIe x4 M.2 slots
Next-gen Connectivity: Dual USB4 Type-C ports
Blazing Fast Networks: 10GbE + 2.5 GbE Dual LAN and Wi-Fi 7
PCIe UD Slot X:PCIe 5.0 x16 slot with 10X strength for graphics card
EZ-Latch Click:M.2 heatsinks with screwless design
EZ-Latch Plus:M.2 slots with quick release design
Hi-Fi Audio with DTS:X® Ultra:ALC4080+ALC897 CODEC
UC BIOS:User-Centred intuitive UX with Quick Access function
Revolutionary Power Design
The TRX50 AERO D motherboard is designed for content creators, enthusiasts, and AI professionals. Equipped with the all-digital 16+8+4 phases power design of the Infineon multiphase PWM controller, the TRX50 AERO D unleashes exceptional performance of the new generation AMD Ryzen Threadripper CPU, while providing the best stability under heavy workloads and committing the most powerful HEDT platform to builders.
Digital VRM Design
Ensures stable high-power delivery for exceptional performance.
16 VCORE Phases 108A SPS
to unleash the full potential of multi-core CPU performance.
8 SOC Phase SPS + DrMOS
for CPU integrated GPU performance and memory control.
4 MISC Phases 108A SPS
provide stable power for CPU-connected PCIe lanes.
Advanced Thermal
With enlarged full metal thermal design, TRX50 AERO D motherboard birngs you exceptional performance while keep the system cool and solid.
VRM Thermal Armor Advanced
These solid heatsinks are forged to keep your system cool.
M.2 Thermal Guard
The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Leading DDR5 Performance, Maximum Capacity
TRX50 AERO D supports the max. memory capacity of DDR5 RDIMM up to 1TB, which brings crucial advantage when running high-demand computing like video editing, 3D rendering, high-resolution content creation, simulation, AI training, and etc..
Leading DDR5 Performance, Maximum Capacity
TRX50 AERO D supports the max. memory capacity of DDR5 RDIMM up to 1TB, which brings crucial advantage when running high-demand computing like video editing, 3D rendering, high-resolution content creation, simulation, AI training, and etc..
DDR5 Overclocking Up to
7800 MT/s
Ultimate Scalability
Brings you the future-proofing capability
Triple PCIe x 16 slots for Multi-GPU
Triple slot width design
4X M.2 slots with EZ-latch Click
Mega Connectivity
Dual USB4 Type-C
Wi-Fi 7
Ultra-high Gain Antenna
Dual LAN 10G+2.5G
True Hi-Fi Music
Get everything UD
GIGABYTE Ultra Durable Technology represents our highest standards to provide a platform for gamers that is not only powerful but also durable and reliable. TRX50 AERO D motherboard is built to last longer and stand stronger.
Elevating Performance Together
TRX50 AERO D signifies our dedication to BIOS optimization. Through our community partnership, we're making next-gen performance more user-friendly.
Specifications
CPU
AMD Socket sTR5, support for:
AMD Ryzen Threadripper PRO 7000 processors / AMD Ryzen Threadripper 7000 Series processors
Chipset
AMD TRX50
Memory
Support for DDR5 7800(O.C.)/7600(O.C.)/7200(O.C.)/7000(O.C)/6800(O.C.)/6400(O.C.)/6000(O.C.)/5600(O.C.)/5200/4800/4400 MT/s ECC Registered memory modules (RDIMM/RDIMM-3DS)
4 x DDR5 DIMM sockets supporting up to 1TB (256 GB single DIMM capacity) of system memory
Quad channel memory architecture
Support for AMD EXtended Profiles for Overclocking (AMD EXPO) and Extreme Memory Profile (XMP) memory modules
Audio
Realtek ALC4080 CODEC (rear panel audio)
Support for DTS:X Ultra
High Definition Audio
2-channel
Realtek ALC897 CODEC (front panel audio)
LAN
Marvell AQtion AQC113C 10GbE LAN chip (10 Gbps/5 Gbps/2.5 Gbps/1 Gbps/100 Mbps) (LAN1)
Realtek 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) (LAN)
Wireless Communication Module
Qualcomm Wi-Fi 7 QCNCM865
802.11a, b, g, n, ac, ax, be, supporting 2.4/5/6 GHz carrier frequency bands
BLUETOOTH 5.3
Support for 11be 320MHz wireless standard
(Actual data rate may vary depending on environment and equipment.)
Note:
Wi-Fi 7 features require Windows 11 SV3 to function properly. (There is no support driver for Windows 10)
Wi-Fi 7 channels on 6GHz band availability depends on individual country's regulations.
Expansion Slots
CPU:
2 x PCI Express x16 slots, supporting PCIe 5.0 and running at x16 (PCIEX16_1/PCIEX16_2)
1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16(PCIEX16_3)
Storage Interface
CPU:
1 x M.2 connector (Socket 3, M key, type 25110/2280 PCIe 5.0 x4/x2 SSD support) (M2C_CPU)
2 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 5.0 x4/x2 SSD support) (M2A_CPU/M2B_CPU)
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2D_CPU)
CPU+Chipset:
8 x SATA 6Gb/s connectors
RAID 0, RAID 1, and RAID 10 support for NVMe SSD storage devices
RAID 0, RAID 1, and RAID 10 support for SATA storage devices
USB
CPU:
3 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
Chipset+Intel JHL8540 USB4 controller:
2 x USB4 USB Type-C ports on the back panel
Chipset:
1 x USB Type-C port with USB 3.2 Gen 2x2 support, available through the internal USB header
1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
CPU+USB 3.2 Gen 1 Hub:
4 x USB 3.2 Gen 1 ports on the back panel
Chipset+USB 2.0 Hub:
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
1 x CPU fan header
1 x CPU fan/water cooling pump header
4 x system fan headers
4 x system fan/water cooling pump headers
3 x addressable RGB Gen2 LED strip headers
1 x RGB LED strip header
4 x M.2 Socket 3 connectors
8 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB Type-C® header, with USB 3.2 Gen 2x2 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x noise detection header
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only)
1 x power button
1 x Clear CMOS button
1 x reset button
1 x reset jumper
2 x temperature sensor headers
1 x Clear CMOS jumper
Back Panel Connectors
1 x Q-Flash Plus button
2 x SMA antenna connectors (2T2R)
1 x DisplayPort In port
1 x USB4® USB Type-C port (DisplayPort)
1 x USB4® USB Type-C port
4 x USB 3.2 Gen 2 Type-A ports (red)
4 x USB 3.2 Gen 1 ports
2 x RJ-45 ports
2 x audio jacks
I/O Controller
iTE I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control
Noise detection
BIOS
1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for GIGABYTE Control Center (GCC)
Support for Q-Flash
Support for Q-Flash Plus
Bundled Software
Norton Internet Security (OEM version)
LAN bandwidth management software
Operating System
Support for Windows 11 64-bit
Form Factor
E-ATX Form Factor; 30.5cm x 26.4cm
