The LANCER BLADE adopts a low-profile heatsink design, removing height consideration from heatsink assembly, and making the product suitable for installation in small chassis. The heatsink is decorated in simple geometric lines, which are a versatile look when paired with various chassis types. The LANCER BLADE has undergone strict component selection and screening procedures, and passed reliability and compatibility tests. It is strong and durable, offering the highest quality! The LANCER BLADE supports AMD EXPO and is compatible with the latest AMD platform. It also supports Intel XMP 3.0 overclocking, providing players with excellent overclocking performance.
Features
Compact Low-Profile Heatsink Design
PMIC for power supply stability
On-die ECC error correction
High-quality materials for stable overclocking
Works with the Latest AMD Platforms
Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking
Specifications
Heatsink
Black
Speed
DDR5
CAS Latencies
CL30-40-40
Module Size
64GB
Operating temperature
0°C to 85°C
Storage temperature
-20°C to 65°C
Operating voltage
1.1V-1.4V
Compatibility
DDR5 6000
Dimensions(LxWxH)
133.35 x 33.8 x 7.8mm
Weight
32.9g / 36.2g
Warranty
Limited Lifetime Warrant
Warranty:
Life Time Warranty. Return To Base
FEATURES
|
Internal memory type |
DDR5 |
ECC |
Yes |
CAS latency |
30 |
Memory clock speed |
6000 MHz |
Memory voltage |
1.1,1.4 V |
Cooling type |
Heatsink |
Memory form factor |
288-pin DIMM |
Component for |
PC |
Internal memory |
64 GB |
Memory layout (modules x size) |
2 x 32 GB |
Intel Extreme Memory Profile (XMP) |
Yes |
Intel Extreme Memory Profile (XMP) version |
3.0 |
Buffered memory type |
Unregistered (unbuffered) |
OPERATIONAL CONDITIONS
|
Storage temperature (T-T) |
-20 - 65 °C |
Operating temperature (T-T) |
0 - 85 °C |
WEIGHT & DIMENSIONS
|
Weight |
36.2 g |
Height |
7.8 mm |
Width |
33.8 mm |
Depth |
133.3 mm |