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Intel i7 11700 Rocket Lake Eight Core 2.5GHz 1200 Socket Processor

Key Specifications
Socket1200
On-Chip GraphicsYes
Speed2.5GHz
Core Quantity8
Manufacturer : INTEL
EAN : 5032037214940
Manufacturer Part Code : BX8070811700
Weight : 0.05 kg
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Key Specifications
Socket1200
On-Chip GraphicsYes
Speed2.5GHz
Core Quantity8
Manufacturer :
INTEL

EAN :
5032037214940

Manufacturer Part Code :
BX8070811700

Weight :
0.05 kg
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Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don't.

Intel® vPro™ Platform Eligibility

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple ?virtual? platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel's instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user's PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® Stable Image Platform Program (SIPP)

Intel® Stable Image Platform Program (Intel® SIPP) can help your company identify and deploy standardized, stable image PC platforms for at least 15 months.

Intel® Deep Learning Boost (Intel® DL Boost)

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Chip Name
BX8070811700 Rocket Lake

Socket
LGA1200

CPU Size
14nm

Number of Cores
8

Number of Threads
16

Base Clock Speed (up to)
2.50GHz

Turbo Boost Technology 2.0 (up to)
4.90GHz

Turbo Boost Technology 3.0 (up to)
4.80GHz

Thermal Velocity (up to)
N/A

Unlocked Core Multiplier
N

Processor Graphics
Intel UHD Graphics 750

GPU Base Speed
350 MHz

GPU Max Speed
1.30GHz

Cache
16MB Intel Smart Cache

TDP
65w

Heatsink
Yes

Packaging
Retail
Manufacturer's Website:
Warranty:
3 Years Manufacturers Warranty, Tel: 0870 607 2439
ENERGY MANAGEMENT
Thermal Design Power (TDP) 65 W
FEATURES
Supported instruction sets SSE4.1,SSE4.2,AVX 2.0,AVX-512
PCI Express slots version 4.0
Execute Disable Bit Y
Idle States Y
Thermal Monitoring Technologies Y
Scalability 1S
CPU configuration (max) 1
Embedded options available N
PCI Express configurations 1x16+1x4,2x8+1x4,1x8+3x4
Thermal Design Power (TDP) 65 W
Device ID 0x4C8A
Maximum number of PCI Express lanes 20
Market segment Desktop
Processor package size 37.5 x 37.5 mm
Harmonized System (HS) code 8542310001
Processor ARK ID 212279
Export Control Classification Number (ECCN) 5A992CN3
Commodity Classification Automated Tracking System (CCATS) G167599
GRAPHICS
On-board graphics adapter model Intel UHD Graphics 750
Discrete graphics adapter model Not available
On-board graphics adapter Y
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1300 MHz
Maximum resolution (DisplayPort) 5120 x 3200 pixels
Number of execution units 32
On-board graphics adapter ID 0x4C8A
On-board graphics adapter 4K support Y
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel) 5120 x 3200 pixels
On-board graphics adapter refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz
On-board graphics adapter refresh rate at maximum resolution (DisplayPort) 60 Hz
On-board graphics adapter refresh rate at maximum resolution (HDMI) 60 Hz
Maximum on-board graphics adapter memory 64 GB
Number of displays supported by on-board graphics adapter 3
On-board graphics adapter maximum resolution (HDMI) 4096 x 2160 pixels
On-board graphics adapter OpenGL version 4.5
Discrete graphics adapter N
MEMORY
ECC N
Memory bandwidth (max) 50 GB/s
Supported memory types DDR4-SDRAM
Memory channels support Dual-channel
Maximum internal memory supported by processor 128 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Memory bandwidth supported by processor (max) 50 GB/s
OPERATIONAL CONDITIONS
Tjunction 100 °C
OTHER FEATURES
Maximum internal memory 128 GB
CPU configuration (max) 1
PACKAGING DATA
Package type Retail box
PROCESSOR
Processor model i7-11700
Processor manufacturer Intel
Processor process 14 nm
Processor family 11th gen Intel® Core™ i7
Box Y
Processor socket LGA 1200 (Socket H5)
Processor number of cores 8
System bus 8 GT/s
Processor number of threads 16
Processor operating modes 64-bit
Turbo frequency (max) 4.9 GHz
Component for PC/Thin Client/Tablet
Processor cache 16 MB
Thermal Design Power (TDP) 65 W
Processor cache type Smart Cache
Memory bandwidth supported by processor (max) 50 GB/s
Processor ARK ID 212279
Processor base frequency 2.5 GHz
PROCESSOR SPECIAL FEATURES
Intel Identity Protection Technology Y
Intel Hyper-Threading Technology Y
Intel Turbo Boost Technology 2.0
Intel Quick Sync Video Technology Y
Intel InTru 3D Technology Y
Intel Clear Video HD Technology Y
Intel AES New Instructions Y
Enhanced Intel SpeedStep Technology Y
Intel Trusted Execution Technology Y
Intel VT-x with Extended Page Tables (EPT) Y
Intel Secure Key Y
Intel 64 Y
Intel Stable Image Platform Program (SIPP) Y
OS Guard Y
Intel Virtualization Technology for Directed I/O (VT-d) Y
Intel Clear Video Technology Y
Intel Software Guard Extensions (Intel SGX) N
Intel Virtualization Technology (VT-x) Y
Intel Turbo Boost Max Technology 3.0 Y
Intel® Boot Guard Y
Intel® Thermal Velocity Boost N
Intel® vPro? Platform Eligibility Y
Intel® Deep Learning Boost (Intel® DL Boost) Y
Intel® Turbo Boost Max Technology 3.0 frequency 4.9 GHz
Intel® Turbo Boost Technology 2.0 frequency 4.8 GHz
Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 Y
TECHNICAL DETAILS
Supported instruction sets SSE4.1,SSE4.2,AVX 2.0,AVX-512
Supported memory types DDR4-SDRAM
PCI Express slots version 4.0
Intel Identity Protection Technology Y
Intel Hyper-Threading Technology Y
Intel Turbo Boost Technology 2.0
Intel Quick Sync Video Technology Y
Intel InTru 3D Technology Y
Intel Clear Video HD Technology Y
Intel AES New Instructions Y
Enhanced Intel SpeedStep Technology Y
Execute Disable Bit Y
Idle States Y
Thermal Monitoring Technologies Y
Intel Trusted Execution Technology Y
Scalability 1S
CPU configuration (max) 1
Intel VT-x with Extended Page Tables (EPT) Y
Embedded options available N
PCI Express configurations 1x16+1x4,2x8+1x4,1x8+3x4
Thermal Design Power (TDP) 65 W
Intel Secure Key Y
Intel 64 Y
Intel Stable Image Platform Program (SIPP) Y
Intel Virtualization Technology for Directed I/O (VT-d) Y
Cache type Smart Cache
Status Launched
Launch date Q1''21
Intel Virtualization Technology (VT-x) Y
Market segment Desktop
Target market Gaming, Content Creation
WEIGHT & DIMENSIONS
Processor package size 37.5 x 37.5 mm

 
Contact Information

Target Components Ltd
Unit 5
Pioneer Way
Pioneer Ind Est
Castleford
WF10 5QU

Tel:01977 739 300
email: sales@targetcomponents.co.uk

 
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